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Embedded mechatronic systems : analysis of failures, predictive reliability. Volume 1 / edited by Abdelkhalak El Hami and Philippe Pougnet.

Contributor(s): Material type: TextTextPublisher: ISTE Press ; Elsevier : London ; Oxford, United Kingdom, 2015Description: xv, 236 pages : illustrations ; 24 cmContent type:
  • text
Media type:
  • unmediated
Carrier type:
  • volume
ISBN:
  • 9781785480133
Subject(s): DDC classification:
  • 621.3 Em13
Contents:
Reliability-based design optimization -- Non-destructive characterization by spectroscopic ellipsometry of interfaces in mechatronic devices -- Method of characterizing the electromagnetic environment in hyperfrequency circuits encapsulated within metallic cavities -- Metrology of static and dynamic displacements and deformations using full-field techniques -- Characterization of switching transistors under electrical overvoltage stresses -- Reliability of radio frequency power transistors to electromagnetic and thermal stress -- Internal temperature measurement of electronic components -- Reliability prediction of embedded electronic systems: the FIDES guide - -Study of the dynamic contact between deformable solids.
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Holdings
Item type Current library Shelving location Call number Copy number Status Date due Barcode
Books Books Main Library-Nabua Engineering Section ENG 621.3 Em13 2015 (Browse shelf(Opens below)) 1-2 Available 025561
Books Books Main Library-Nabua Engineering Section ENG 621.3 Em13 2015 (Browse shelf(Opens below)) 2-2 Available 025562

Includes bibliographical references and index.

Reliability-based design optimization -- Non-destructive characterization by spectroscopic ellipsometry of interfaces in mechatronic devices -- Method of characterizing the electromagnetic environment in hyperfrequency circuits encapsulated within metallic cavities -- Metrology of static and dynamic displacements and deformations using full-field techniques -- Characterization of switching transistors under electrical overvoltage stresses -- Reliability of radio frequency power transistors to electromagnetic and thermal stress -- Internal temperature measurement of electronic components -- Reliability prediction of embedded electronic systems: the FIDES guide - -Study of the dynamic contact between deformable solids.

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