Embedded mechatronic systems : analysis of failures, predictive reliability. Volume 1 / edited by Abdelkhalak El Hami and Philippe Pougnet.
Material type: TextPublisher: ISTE Press ; Elsevier : London ; Oxford, United Kingdom, 2015Description: xv, 236 pages : illustrations ; 24 cmContent type:- text
- unmediated
- volume
- 9781785480133
- 621.3 Em13
Item type | Current library | Shelving location | Call number | Copy number | Status | Date due | Barcode | |
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Books | Main Library-Nabua | Engineering Section | ENG 621.3 Em13 2015 (Browse shelf(Opens below)) | 1-2 | Available | 025561 | ||
Books | Main Library-Nabua | Engineering Section | ENG 621.3 Em13 2015 (Browse shelf(Opens below)) | 2-2 | Available | 025562 |
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ENG 621.3 El253 2021 Electrical and electronic devices, circuits and materials : design and applications / | ENG 621.3 El254 2017 Electrician : a basic course | ENG 621.3 Em13 2015 Embedded mechatronic systems : analysis of failures, predictive reliability. Volume 1 / | ENG 621.3 Em13 2015 Embedded mechatronic systems : analysis of failures, predictive reliability. Volume 1 / | ENG 621.3 G181e 2016 Electrical technology | ENG 621.3 G223e 2011 Electronics an introduction/ | ENG 621.3 G223e 2011 Electronics an introduction/ |
Includes bibliographical references and index.
Reliability-based design optimization -- Non-destructive characterization by spectroscopic ellipsometry of interfaces in mechatronic devices -- Method of characterizing the electromagnetic environment in hyperfrequency circuits encapsulated within metallic cavities -- Metrology of static and dynamic displacements and deformations using full-field techniques -- Characterization of switching transistors under electrical overvoltage stresses -- Reliability of radio frequency power transistors to electromagnetic and thermal stress -- Internal temperature measurement of electronic components -- Reliability prediction of embedded electronic systems: the FIDES guide - -Study of the dynamic contact between deformable solids.
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